Die Bonding System
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs.
As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required.
This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
What the supplier must deliver
Funding is available to purchase a die
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs.
As a result, a crucial aspect
As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required.
This stipulation lends itself to a semi-automated
This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
Derived from the notice text — always confirm against the original documents.
- OCID
- 21933349-7465-49c1-a0c0-59f1caeb33ed
- Stage
- contract · Contract
- Source
- Contracts Finder
- Buyer ref
- tender_528696/1590180
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