ClosedStage · contract
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Electrical EquipmentCPV 31712000
ValueValue not published
Deadline19 Jan 2024
Published21 Feb 2024
RegionSouth East
Published 21 Feb 2024ClosedCloses 19 Jan 2024
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UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
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- OCID
- 7ae3de7f-fb7f-46f9-a438-61fa3bab3a65
- Stage
- contract · Contract
- Source
- Contracts Finder
- Buyer ref
- BIP842499336
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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