RFP QuestBeta
OpenStage · tender 29 days to close

University of Strathclyde

Supply, Delivery and Installation of Power Semiconductor Reliability Testing Equipment

Laboratory EquipmentCPV 38000000
Value£1.0m
Deadline19 Aug 2026
Published20 Jul 2026
RegionNationwide
Timeline
Published 20 Jul 202629 days leftCloses 19 Aug 2026
Who to contact
Anna Sanina
anna.sanina@strath.ac.uk
+44 7811592949

The procurement contact named on the official notice.

How to submit
Open the submissions portal

The submission route named on the official notice.

Contract value in context
£1.0mtotal contract value
median £70k
this tender£0£1.1m

This is a large award for Laboratory & Precision Equipment — above three-quarters of comparable contracts. Based on 9,869 valued Laboratory & Precision Equipment tenders in our corpus.

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The brief

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure.

Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.

The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.

NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.

Description This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows: (1) Climatic chamber 1 for high temperature bias test, (2) Climatic chamber 2 for high temperature and high humidity bias test, (3) Thermal shock test chamber.

Key requirements

What the supplier must deliver

01

NCASP is creating an integrated, industry-led scale-up

NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology.

02

This tender is to ensure that

This tender is to ensure that the devices packaged by the facility or our clients meet industry standards, the facility is planning to procure three reliability testing equipment/systems as follows:.

Derived from the notice text — always confirm against the original documents.

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Source & provenance
OCID
ocds-h6vhtk-06cea6
Stage
tender · Open
Source
Find a Tender
Buyer ref
068163-2026
View the original notice on Find a Tender

Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.

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